Electrode for lead-salt diodes

Details Electrode for lead-salt diodes Electrode for lead-salt diodes

1980-05-16

1982-09-21

James, Andrew J.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

357 17, 357 30, 357 52, 357 61, 357 63, 357 67, 357 62, 357 71, 29590, 427 92, H01L 29161, H01L 29205, H01L 29225

Patent

active

043509908

ABSTRACT:
A significantly more stable ohmic contact for a lead-salt semiconductor surface, especially for use in infrared lasers. The contact has layers of platinum, palladium or nickel alternating with gold, and then covered with indium. An Au-Pd-Au-In contact is used on lead-sulfide-selenide, lead-tin-selenide, and lead-tin-telluride of high tin content. A Pt-Au-Pt-Sn contact is preferred for lead-tin-telluride of low tin content. Lower contact resistance is attained if P type lead-tin-selenide and lead-tin-telluride surfaces are previously doped with oxygen, and the initial metal layer is applied in a manner that does not remove it.

REFERENCES:
patent: 2962394 (1960-11-01), Andres
patent: 3716424 (1973-02-01), Schoolar
patent: 3896473 (1975-07-01), Dilorenzo
patent: 3911469 (1975-10-01), Wrobel
patent: 4000508 (1976-12-01), Hager et al.
patent: 4017887 (1977-04-01), Davies et al.
patent: 4021836 (1977-05-01), Andrews et al.
patent: 4048535 (1977-09-01), Cox et al.
patent: 4053919 (1977-10-01), Andrews et al.
patent: 4064621 (1977-12-01), Lo
patent: 4321617 (1982-03-01), Duda et al.

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