Electrode for electrical connection to oxide superconductor and

Details Electrode for electrical connection to oxide superconductor and Electrode for electrical connection to oxide superconductor and

1990-09-20

1992-09-15

Wyszomierski, George

Superconductor technology: apparatus, material, process

High temperature , per se

Having tc greater than or equal to 150 k

428632, 428672, 428673, 428930, H01L 3912

Patent

active

051478498

ABSTRACT:
A metal electrode formed on an oxide superconductor for electric connection to the oxide superconductor, includes a first layer of Ag in direct contact with the oxide superconductor, and a second layer formed on the first layer. The second layer is formed of noble metal excluding Ag.
The metal electrode can be formed by forming a first layer of Ag to cover a whole surface of the oxide superconductor layer, and forming a second layer of noble metal excluding Ag, to cover a whole surface of the first layer, thereby to form a double metal layer, and patterning the double metal layer so as to form a metal electrode composed of the double metal layer.

REFERENCES:
patent: 4963523 (1990-10-01), Ekin et al.
patent: 4994435 (1991-02-01), Shiga et al.
patent: 5068219 (1991-11-01), Hagino et al.
patent: 5074223 (1992-01-01), Maroni
Tzeng, Y., "Fabrication of Electrical Contacts to YBa.sub.2 Cu.sub.3 O.sub.7-x Superconductor by Molten Silver Processing", Journal of the Electrochemical Society, vol. 135, No. 5, pp. 1309-1310, May 1988 (505/706).
Y. Iye et al., "A simple method for attaching electrical leads to smal samples of high-Tc oxides", Japanse Journal of Applied Physics, vol. 27, No. 4, Apr. 1988, pp. 658-660, Tokyo, JP.
Y. Tazoh et al., "Low resistance ohmic contacts to high-Tc superconducting thin films", IEEE Transactions On Magnetics, vol. 25, No. 2, Aug. 1989, pp. 2049-2052, New York, US.
P. Y. Hsieh et al., "Electrical conductivity and buffer-layer studies of high Tc superconductors by C-V measurements", Proceedings Of The 2nd Annual Conference On Superconductivity And Its Applications, Apr. 18, 1988, pp. 214-222, Buffalo, US.

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