Patent
1986-10-24
1988-12-27
James, Andrew J.
357 72, H01L 2328, H01L 2348
Patent
active
047944463
ABSTRACT:
Portions adjacent to the tips of a plurality of leads taken out from at least one side of a package for protecting a semiconductor device are embedded in an integral insulating mold resin to maintain intervals between the adjacent leads and, each of the leads is bent at two portions so that the tip portion of each lead is positioned at the lower surface of said package.
Clark S. V.
James Andrew J.
Mitsubishi Denki & Kabushiki Kaisha
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