Electrode connection structure of flat device

Details Electrode connection structure of flat device Electrode connection structure of flat device

1985-11-13

1987-08-04

James, Andrew J.

357 80, 357 70, 357 79, 357 75, H01L 2332, H01L 2312, H01L 21603

Patent

active

046849742

ABSTRACT:
A film carrier on which semiconductor devices are disposed and which is excised so as to have a predetermined size and has leads in at least two directions is placed on a connecting frame member which has a cushion material at one end and in which a circuit substrate is fixed to the other end. The lead at one end of the film carrier is disposed on the cushion material and the opposite surface of this lead contacts with a group of external lead-out electrodes of the flat device mounted on the cushion material. The lead at the other end of the film carrier is connected to the circuit substrate. A supporting frame member is fixed to the connecting frame member such that it comes into pressure contact with the opposite surfaces of the group of external lead-out electrodes of the flat device.

REFERENCES:
patent: 4381131 (1983-04-01), Demianiuk

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