Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1996-12-17
1999-11-02
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
118723E, 118723R, 118 72R, H05H 100
Patent
active
059763094
ABSTRACT:
An electrode assembly for a plasma reactor used in connection with fabrication or manufacture of semiconductor devices. The electrode assembly includes an anode having, a top side that includes a pedestal adapted to support a wafer and defines an annular void that preferably surrounds the pedestal and extends to an outer periphery of the top side. The electrode assembly also includes a ring removably received within the annular void so that the ring extends from the pedestal and covers substantially the entire portion of the top side of the anode save the pedestal. The thickness of the ring is slightly less than the height of the pedestal so that the top surface of the ring is located below the top surface of the pedestal. When the wafer is supported by the pedestal during fabrication of a semiconductor device, the wafer extends beyond the circumference of the pedestal, and a gap is defined between the wafer and the removable ring. The removable ring can be quickly and easily removed and replaced.
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Dang Thi
LSI Logic Corporation
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