Electrode assembly for measuring the effective thickness of thru

Electricity: measuring and testing – Conductor identification or location – Inaccessible

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324 65P, 324158P, G01R 2714

Patent

active

040428800

ABSTRACT:
An improved electrode construction for apparatus for testing the integrity of thru-hole plating in printed circuit boards and the like by measuring the effective thickness thereof. A first conically shaped electrode assembly is adapted to be displaced along a predetermined path into engagement with one of the defining marginal perimetric edges of a plated thru-hole in a circuit board. A second and complementally shaped electrode assembly is adapted to be displaced into engagement with the other defining marginal perimetric edge of the thru-hole. Each of such electrode assemblies includes a pair of discrete selectively contoured electrode elements adapted to make line contact with the marginal defining edges of the thru-hole, whereby a predetermined magnitude of constant current can be passed through the plating intermediate one pair of electrode elements, and the voltage drop developed thereby across the thru-hole plating measured by the other pair of electrode elements.

REFERENCES:
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Gee et al., A Versatile Over-Under Four-Point Probe Apparatus, J. Phys. E. (GB), Jan. 1971, pp. 70-72.
Murcko, Split-Tip For Terminal Resistance Measurements, IBM Technical Disclosure Bulletin, July 1971, p. 479.

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