Electrode array having a thin, flexible substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C600S377000

Reexamination Certificate

active

06624510

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to an electrode array and a method of manufacturing an electrode array, and in particular, to a neurological electrode array microfabricated on a flexible substrate utilizing biocompatible materials.
2. Background of the Related Art
A current challenge in the neural sciences is to monitor and to simulate neural activity with high spatial resolution. This requires a large number of electrodes within a small area, and independent, low noise connections to data acquisition equipment. Current microfabrication techniques are capable of making these electrode arrays, but the potential use on human subjects greatly restricts the materials and physical characteristics that can be employed.
SUMMARY OF THE INVENTION
An object of the invention is to solve at least the above problems and/or disadvantages and to provide at least the advantages described hereinafter.
A further object of the invention is to provide a small biocompatible electrode array that can be utilized for electrophysiologic studies in humans and other mammals.
Another object of the invention is to create significantly high contact density than currently commercially available devices.
An electrode array according to a preferred embodiment of the invention includes a flexible substrate, and a plurality of electrodes disposed on the flexible substrate. The flexible substrate is preferably formed of polyimide. The contacts preferably have a diameter in the range of approximately 10 &mgr;m to 1 mm, more preferably approximately 30 &mgr;m to 200 &mgr;m.
The electrode array is manufactured according to a preferred method of the invention by forming a plurality of electrodes on a flexible substrate by forming a metal line on the flexible substrate for each of the plurality of electrodes by depositing one or more metals using electron beam evaporation and then patterning the one or more metals. A contact is then formed on the flexible substrate for each of the plurality of electrodes using one of electroplating and embossing. An insulating film is formed on the flexible substrate except over the contacts and areas of the electrodes utilized for connections to an electrical device. Preferably, electroplating is utilized to form contacts less than approximately 100 &mgr;m in diameter, and embossing is utilized to form contacts greater than approximately 100 &mgr;m in diameter.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objects and advantages of the invention may be realized and attained as particularly pointed out in the appended claims.


REFERENCES:
patent: 4735208 (1988-04-01), Wyler et al.
patent: 4763660 (1988-08-01), Kroll et al.
patent: 4819648 (1989-04-01), Ko
patent: 4869255 (1989-09-01), Putz
patent: 4903702 (1990-02-01), Putz
patent: 5097835 (1992-03-01), Putz
patent: 5215088 (1993-06-01), Normann et al.
patent: 5496369 (1996-03-01), Howard, III
patent: 5676655 (1997-10-01), Howard, III et al.
patent: 5697975 (1997-12-01), Howard, III et al.
patent: 5698083 (1997-12-01), Glass
patent: 5713847 (1998-02-01), Howard, III et al.
patent: 5735885 (1998-04-01), Howard, III et al.
patent: 5776111 (1998-07-01), Tesio
patent: 5800535 (1998-09-01), Howard, III
patent: 5820588 (1998-10-01), Howard, III
patent: 5843093 (1998-12-01), Howard, III
patent: 5902236 (1999-05-01), Iversen
patent: 5938689 (1999-08-01), Fischell et al.
patent: 6024702 (2000-02-01), Iversen
patent: 6052608 (2000-04-01), Young et al.
patent: 6201707 (2001-03-01), Sota

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrode array having a thin, flexible substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrode array having a thin, flexible substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrode array having a thin, flexible substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3094433

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.