Electroconductive silicone pressure-sensitive adhesive...

Details Electroconductive silicone pressure-sensitive adhesive... Electroconductive silicone pressure-sensitive adhesive...

2006-01-31

2006-01-31

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S514000

Reexamination Certificate

active

06991751

ABSTRACT:
A conductive powder is incorporated in a pressure-sensitive adhesive composition comprising a silicone gum, an MQ resin, and a crosslinking agent. The conductive powder consists of core particles of inorganic material or organic resin, an interlayer of silicon-base polymer, and a metal plating. The resulting conductive silicone pressure-sensitive adhesive composition is satisfactorily adherent to silicone rubber and cures into a product that exhibits stable conductivity and adhesive properties in the temperature region where silicone rubber is used.

REFERENCES:
patent: 5312690 (1994-05-01), Fukuda et al.
patent: 6414078 (2002-07-01), Fukushima et al.
patent: 6485831 (2002-11-01), Fukushima et al.
patent: 6815076 (2004-11-01), Aoki
patent: 63-22886 (1988-01-01), None
patent: 1-287169 (1989-11-01), None
patent: 2928944 (1999-05-01), None
patent: 2001-146578 (2001-05-01), None
patent: 2002-167512 (2002-06-01), None

Affiliated with

Also associated with

Rating

Electroconductive silicone pressure-sensitive adhesive... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroconductive silicone pressure-sensitive adhesive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroconductive silicone pressure-sensitive adhesive... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3544061