Electroconductive resin paste containing mixed epoxy resin and e

Details Electroconductive resin paste containing mixed epoxy resin and e Electroconductive resin paste containing mixed epoxy resin and e

1991-04-17

1993-02-23

Clingman, A. Lionel

Compositions

Electrically conductive or emissive compositions

Free metal containing

252513, 252514, 156330, 523427, 523457, 524 94, 524183, H01B 122

Patent

active

051887673

ABSTRACT:
An electroconductive resin paste suitable for bonding a semiconductor element onto a substrate and exhibiting a superior adhesion strength and processability when heated to 200.degree. C. to 350.degree. C., and a process for producing a semiconductor device using the electroconductive resin paste are provided, which electroconductive resin paste comprises.

REFERENCES:
patent: 3859379 (1975-01-01), Kitamura et al.
patent: 3909480 (1975-09-01), Ogata et al.
patent: 4033905 (1977-07-01), Bloom et al.
patent: 4732702 (1988-03-01), Yamazaki et al.
patent: 4803543 (1989-02-01), Inayoshi et al.
patent: 4903119 (1990-02-01), Ito et al.
patent: 5010143 (1991-04-01), Evans et al.

Affiliated with

Also associated with

Rating

Electroconductive resin paste containing mixed epoxy resin and e does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroconductive resin paste containing mixed epoxy resin and e, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroconductive resin paste containing mixed epoxy resin and e will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2202649