Electroconductive resin paste

Details Electroconductive resin paste Electroconductive resin paste

1987-01-20

1988-03-22

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

252514, 252518, 524430, 524439, 524401, 524437, 523457, 523459, H01B 106

Patent

active

047327022

ABSTRACT:
An electroconductive resin paste, comprising a resin obtained by reacting 0.01 to 0.5 carboxylic acid equivalent of a homopolymer or a copolymer of butadiene having carboxylic acid terminal groups with 1 epoxy equivalent of an epoxy resin having two or more epoxy groups in one molecule, a curing agent and an electroconductive filler which is (i) an electroconductive metal powder or (ii) an inorganic insulating powder coated with a surface electroconductive film, said electroconductive filler being in an amount of from 60 to 95% by weight based on the resin and the electroconductive filler.

REFERENCES:
patent: 4369068 (1983-01-01), Hausselt et al.
patent: 4410457 (1983-10-01), Fuyumura et al.
patent: 4496475 (1985-01-01), Abrams
patent: 4575432 (1986-03-01), Lin et al.
patent: 4581158 (1986-04-01), Lin
patent: 4595604 (1986-06-01), Martin et al.

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