Electroconductive resin composition

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing

Reexamination Certificate

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C428S922000, C361S679090

Reexamination Certificate

active

10495656

ABSTRACT:
An electroconductive resin composition useful for packaging an electronic device, is provided, whereby a drawback that carbon black is likely to fall off from the surface of a molded product by abrasion, has been overcome. It is an electroconductive resin composition which comprises at least one thermoplastic resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin, and carbon black and which contains a styrene/butadiene/butylene/styrene block copolymer or a mixture of such a copolymer with an olefinic resin, and has a surface resistivity of from 102to 1010Ω. Contamination of IC, etc., to be caused by falling off of carbon black, etc. by abrasion when contacted with IC, etc., can be substantially reduced.

REFERENCES:
patent: 5322874 (1994-06-01), Fujii et al.
patent: 5415906 (1995-05-01), Miyakawa et al.
patent: 5707699 (1998-01-01), Miyakawa et al.
patent: 5747164 (1998-05-01), Miyakawa et al.
patent: 5876632 (1999-03-01), Miyakawa et al.
patent: 5955164 (1999-09-01), Miyakawa et al.
patent: 6485832 (2002-11-01), Kosugi et al.
patent: 6759130 (2004-07-01), Kosugi et al.
patent: 2003/0036602 (2003-02-01), Adedeji et al.
patent: 1373153 (2002-10-01), None
patent: 0 355 602 (1990-02-01), None
patent: 0 562 179 (1993-09-01), None
patent: 1125985 (2001-08-01), None
patent: 08-188710 (1996-07-01), None
patent: 08-337714 (1996-12-01), None
patent: 2002-256125 (2002-09-01), None
patent: 2002-355935 (2002-12-01), None
U.S. Appl. No. 10/635,501, filed Aug. 7, 2003, Kosugi, et al.
U.S. Appl. No. 10/030,103, filed Jan. 17, 2002, Miyakawa, et al.
U.S. Appl. No. 10/030,160, filed Jan. 30, 2002, Miyakawa, et al.
U.S. Appl. No. 10/178,021, filed Jun. 24, 2002, Miyakawa, et al.
U.S. Appl. No. 10/296,937, filed Dec. 10, 2002, Fujimura, et al.
U.S. Appl. No. 10/343,308, filed Jan. 30, 2003, Oda, et al.
U.S. Appl. No. 10/495,656, filed May 17, 2004, Miyakawa, et al.
Patent Abstracts of Japan, JP 08-188710, Jul. 23, 1996 (reference previously filed in Japanese language on May 17, 2004).
Patent Abstracts of Japan, JP 08-337714, Dec. 24, 1996 (reference previously filed in Japanese language on May 17, 2004).

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