Electroconductive paste composition and printed wiring board

Compositions – Electrically conductive or emissive compositions – Free metal containing

Reexamination Certificate

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Details

C252S514000

Reexamination Certificate

active

07416687

ABSTRACT:
There is provided an electroconductive paste composition that can form a coating film having satisfactory thickness by single coating work. The electroconductive paste composition can form bumps having satisfactory height even by a smaller number of times of coating than that in the prior art technique. The electroconductive paste composition comprises a phenolic resin, a melamine resin, an electroconductive powder, a solvent, and a bump forming aid comprising a monohydric alcohol having a terminal methoxy group and having at least one ether bond. The electroconductive paste composition can be used in a printed wiring board.

REFERENCES:
patent: 4765929 (1988-08-01), Shaffer
patent: 6083426 (2000-07-01), Shimasaki et al.
patent: 06-350258 (1994-12-01), None
patent: 09-282937 (1997-10-01), None
patent: 09-286924 (1997-11-01), None
patent: 11-306860 (1999-11-01), None
patent: 2001-011388 (2001-01-01), None
patent: 2002-270033 (2002-09-01), None
patent: 2003-077337 (2003-03-01), None
patent: 2003-331648 (2003-11-01), None
patent: 2004-265826 (2004-09-01), None

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