Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2007-03-30
2008-08-26
Kopec, Mark (Department: 1796)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C252S514000
Reexamination Certificate
active
07416687
ABSTRACT:
There is provided an electroconductive paste composition that can form a coating film having satisfactory thickness by single coating work. The electroconductive paste composition can form bumps having satisfactory height even by a smaller number of times of coating than that in the prior art technique. The electroconductive paste composition comprises a phenolic resin, a melamine resin, an electroconductive powder, a solvent, and a bump forming aid comprising a monohydric alcohol having a terminal methoxy group and having at least one ether bond. The electroconductive paste composition can be used in a printed wiring board.
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Kobayashi Masaru
Nagashima Masayuki
Shirogane Hiroyuki
Uchimi Tsutomu
Burr & Brown
Dai Nippon Printing Co. Ltd.
Kopec Mark
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