Electroconductive paste and method of forming electrode pattern

Details Electroconductive paste and method of forming electrode pattern Electroconductive paste and method of forming electrode pattern

2005-03-15

2005-03-15

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C427S096400, C427S125000

Reexamination Certificate

active

06866800

ABSTRACT:
A conductive paste which can form an electrode having a sufficient solder-wetability, exhibiting sufficient bonding strength, and having a high specific resistance is provided. The conductive paste contains a silver powdery material, glass frit and an organic vehicle. The silver powdery material contains at least about 50% by weight of a high crystalline silver powdery material with a particle size of about 4.5 μm to 7 μm and a crystal size of about 10 nm or more.

REFERENCES:
patent: 4001146 (1977-01-01), Horowitz
patent: 6689186 (2004-02-01), Hampden-Smith et al.
patent: 6800223 (2004-10-01), Kojo et al.
patent: 2004-47856 (2004-02-01), None

Affiliated with

Also associated with

Rating

Electroconductive paste and method of forming electrode pattern does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroconductive paste and method of forming electrode pattern, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroconductive paste and method of forming electrode pattern will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3410685