Electroconductive paste, and method for producing ceramic substr

Details Electroconductive paste, and method for producing ceramic substr Electroconductive paste, and method for producing ceramic substr

1997-11-17

1999-11-16

Speer, Timothy

Stock material or miscellaneous articles

Composite

Of quartz or glass

428323, 428689, 252512, 156 8918, 106 118, B32B 1500, B05B 310, C03B 2900, H01B 102

Patent

active

059854618

ABSTRACT:
Provided is an electroconductive paste for forming via-holes through ceramic substrates, and a method for producing ceramic substrates using the paste. The via-holes formed with the paste crack little during baking, and have high electric reliability and good solderability and platability. The paste comprises from about 80 to 93% by weight of a spherical or granular electroconductive metal powder having a grain size range of between about 0.1 and 50 .mu.m, from about 2 to 10% by weight of an insoluble resin powder having a grain size range of between about 0.1 and 50 .mu.m, and from about 5 to 18% by weight of an organic vehicle. The via-holes 2 formed through a ceramic green sheet 1 are filled with the paste 1, and a plurality of those ceramic green sheets 1 are laminated under heat and baked under a predetermined condition to produce a multi-layered ceramic substrate 6.

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patent: 5807508 (1998-09-01), Kawahara et al.
patent: 5840432 (1998-11-01), Hirai et al.

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