Electroconductive integrated substrate and process for producing

Details Electroconductive integrated substrate and process for producing Electroconductive integrated substrate and process for producing

1989-02-24

1991-06-04

Van Balen, William J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

1563066, 428167, 428188, 428408, B32B 900

Patent

active

050212842

ABSTRACT:
An electroconductive integrated substrate and a process for producing the same, which comprises a porous carbonaceous plate having a large number of pores and gas permeability, and a gas unpermeable electroconductive plate laminated on the porous carbonaceous plate and integrally bonded thereto by thermoplastic resin which is present substantially only in the pores of the porous carbonaceous plate. It is preferred to use thermoplastic resin having a melting viscosity of from 10.sup.2 to 10.sup.6 poises, and a gas permeable porous carbonaceous plate having a mean pore diameter of from 20 to 150 .mu.m and a porosity of from 40 to 85%. The porous carbonaceous plate and the gas impermeable electroconductive plate are laminated one upon the other with a thermoplastic resin film interposed therebetween, and the film is melted to bond the plates together. The integrated substrate obtained has an electrical resistance of not greater than 7 m.OMEGA., preferably not greater than 1.5 m.OMEGA., at the bonded surface in the thickness direction thereof.

REFERENCES:
patent: 4732637 (1988-03-01), Wettling et al.
patent: 4818640 (1989-04-01), Fukuda et al.

Affiliated with

Also associated with

Rating

Electroconductive integrated substrate and process for producing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroconductive integrated substrate and process for producing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroconductive integrated substrate and process for producing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1025612