Electroconductive coating composition, a printed circuit board f

Details Electroconductive coating composition, a printed circuit board f Electroconductive coating composition, a printed circuit board f

1996-04-25

1998-04-07

Yoon, Tae

Compositions

Electrically conductive or emissive compositions

Free metal containing

252520, 524 86, 524186, 524236, 524247, 524413, 524440, H01B 122, C08K 308

Patent

active

057360707

ABSTRACT:
The invention relates to an electroconductive coating composition with excellent conductivity, adhesion to copper foil and solder dip resistance which is suitable for the formation of a jumper circuit and an electromagnetic shield layer, a printed circuit board fabricated with the above composition, and a durable electromagnetic-shielded flexible printed circuit assembly, wherein said coating composition comprises, by weight, 100 parts of copper metal powder coated with 0.05-0.2 parts of titanate or/and zirconate, 5-30 parts of resole phenolic resin, 0.5-4 parts of a chelating agent, 0.1-5 parts of an adhesion improving agent and 0.5-7 parts of a conductivity improving agent. This composition is less expensive than the silver paste, superior to the latter in the conductivity and adhesion to copper foil of the coating film and in solder dip resistance, thus being suited for the construction of a jumper circuit and an electromagnetic shield layer. It lends itself well to the mounting of IC, MSI, LSI, etc. by dipping in a molten solder bath.

REFERENCES:
patent: 4434084 (1984-02-01), Hicks
patent: 4559166 (1985-12-01), Morinago et al.
patent: 4888135 (1989-12-01), Tsunaga et al.
patent: 5068150 (1991-11-01), Nakamura et al.
patent: 5372749 (1994-12-01), Li et al.

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