Electroconductive adhesive comprising an epoxy novolak resin and

Details Electroconductive adhesive comprising an epoxy novolak resin and Electroconductive adhesive comprising an epoxy novolak resin and

1991-01-09

1993-02-02

Lieberman, Paul

Compositions

Electrically conductive or emissive compositions

Free metal containing

252513, 252514, 523457, 523458, 523459, 524439, 524440, 156330, H01B 122

Patent

active

051835924

ABSTRACT:
An electroconductive adhesive comprising an epoxy-novolak resin, a phenol-aralkyl resin, a glycidyl group-containing silane coupling agent, an organic borate and an electro-conductive metal power is excellent in reliability in moisture and hydrolytic resistance and useful for semiconductor devices.

REFERENCES:
patent: 3909480 (1975-09-01), Ogata et al.
patent: 4652398 (1987-03-01), Goswami et al.
patent: 4696764 (1987-09-01), Yamazaki
patent: 4780371 (1988-10-01), Joseph et al.
patent: 4803543 (1989-02-01), Inayoshi et al.
patent: 4880570 (1989-11-01), Sanborn et al.
patent: 5043102 (1991-08-01), Chen et al.

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