Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1988-11-02
1989-11-14
Barr, Josephine
Compositions
Electrically conductive or emissive compositions
Free metal containing
252513, 252514, 252515, 252518, 252519, 523457, 523458, 523459, H01B 106
Patent
active
048805700
ABSTRACT:
An electrically conductive epoxy-based adhesive. The epoxy is selected from the amine curing modified epoxy family consisting of a resin that is a combination of polygylcidylaminophenyl resin and polygylcidylether of phenylformaldehyde novalac resin family and a catalyst that is a combination of one member from the aliphatic amide family plus one member from the aliphatic polyamine family. In one embodiment includes 17 parts by weight of the resin and 10 parts by weight of the catalyst. 73 parts by weight of a mixture of properly shaped silver flake particles are added. The resulting adhesive is curable at room temperature to provide a high-temperature, high-strength, electrically conductive adhesive.
REFERENCES:
patent: 2379976 (1945-07-01), Maddock
patent: 2444034 (1948-06-01), Collings et al.
patent: 2991257 (1961-07-01), Smith-Johannsen
patent: 3332867 (1967-07-01), Miller et al.
patent: 3359145 (1967-12-01), Salyer et al.
patent: 3932311 (1976-01-01), Caldwell et al.
patent: 3983075 (1976-09-01), Marshall et al.
patent: 4054714 (1977-10-01), Mastrangelo
patent: 4113981 (1978-09-01), Matsudo et al.
patent: 4147669 (1979-04-01), Shaheen et al.
patent: 4389340 (1983-06-01), Levy
patent: 4410457 (1983-10-01), Fujimura et al.
patent: 4696764 (1987-09-01), Yamazaki
Boan Bobby J.
Sanborn James A.
Barr Josephine
DeAngelis, Jr. John L.
Harris Corporation
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