Electrochemical reduction treatment for soldering

Details Electrochemical reduction treatment for soldering Electrochemical reduction treatment for soldering

1992-07-14

1993-08-03

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204224R, C25F 100, C25F 700

Patent

active

052325628

ABSTRACT:
The application of electrochemical reduction treatment liquids and electroless reduction treatment liquids to elements such as circuit boards for cleaning metallic surfaces in preparation for soldering is accomplished using a wave of the treatment liquid over a liquid tank. A wave treatment has advantages over spraying, which causes too much atomizing, and dipping, which is slow and requires complicated conveyors that are multi-directional. The method comprises forming a wave of reduction treatment liquid in an atmosphere having a limited included oxygen content and passing components through the wave so the reduction treatment liquid contacts the surfaces to be solder coated.

REFERENCES:
D. M. Tench et al., Electrochemical Assessment of Sn-Pb Solderability, Aug., 1990, pp. 44-46.
H. Akahoshi et al., New Copper Surface Treatment for Polymide Multilayer Printed Wiring Boards, 1987.
E. Lenz, Automatisiertes Loten electronischer Baugruppen, Nov., 1985.

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