Electrochemical process and system for etching semiconductor sub

Details Electrochemical process and system for etching semiconductor sub Electrochemical process and system for etching semiconductor sub

1995-12-27

1997-10-28

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic erosion of a workpiece for shape or surface...

Eroding workpiece of nonuniform internal electrical...

205672, 204224M, 204237, C25F 312, C25F 700

Patent

active

056814488

ABSTRACT:
An electrochemical etching process carried out in an etching system including an electrolysis vessel which is provided thereinside with facing wall surfaces defining therebetween an etching solution flow region. A semiconductor substrate to be etched and a counter electrode are mounted respectively on the facing wall surfaces. A flow stream generating section for the etching solution is formed separate from the etching solution flow region and includes a device for generating the flow stream of the etching solution. The flow stream generating section is connected to the etching solution flow region in such a manner that the etching solution flow in a direction generally parallel with the facing wall surfaces inside the electrolysis vessel. An electric potential is applied between the semiconductor substrate and the counter electrode to accomplish an electrochemical etching on the semiconductor substrate.

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