Electrochemical planarization

Details Electrochemical planarization Electrochemical planarization

1989-05-08

1993-10-26

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437203, 437230, 437245, 437170, 437187, 437194, H01L 21465

Patent

active

052565653

ABSTRACT:
In a process for fabricating planarized thin film metal interconnects for integrated circuit structures, a planarized metal layer is etched back to the underlying dielectric layer by electropolishing, ion milling or other procedure. Electropolishing reduces processing time from hours to minutes and allows batch processing of multiple wafers. The etched back planarized thin film interconnect is flush with the dielectric layer.

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