Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – Gap maintenance or defined tool-workpiece gap
Patent
1994-09-02
1996-10-22
Valentine, Donald R.
Electrolysis: processes, compositions used therein, and methods
Electrolytic erosion of a workpiece for shape or surface...
Gap maintenance or defined tool-workpiece gap
205654, 205668, 205670, 205672, 205674, 205686, 204224M, 204225, C25F 314, C25F 700
Patent
active
055673007
ABSTRACT:
A high speed electrochemical metal removal technique provides for planarization of multilayer copper interconnection in thin film modules. The process uses a neutral salt solution, is compatible with the plating process and has minimum safety and waste disposal problems. The process offers tremendous cost advantages over previously employed micromilling techniques for planarization.
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Contolini et al., "Electrochemical Planarization for Multi-Level Metallization", Proceeding of the the Second International Symposium of Electrochemical Technology Applications in Electronics, vol. No. 93-20.
Datta Madhav
O'Toole Terrence R.
IBM Corporation
Valentine Donald R.
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