Electrochemical interconnection

Details Electrochemical interconnection Electrochemical interconnection

1992-04-27

1994-03-01

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Uniting two separate solid materials

29840, 29843, 205123, 205148, C25D 502

Patent

active

052904237

ABSTRACT:
Processes for fabricating electrochemical interconnections between semiconductor chip pads and substrate pads. First, pads on a substrate are electrically shorted by depositing a film of conductive metal, conductive bumps are created on the substrate pads, and the pads on the substrate are aligned with pads on a semiconductor chip. Then, by electrochemically depositing metal to the bumps, electrical interconnections are formed between the semiconductor chips pads and the substrate pads. Finally, the film of conductive metal is removed to eliminate the electrical shorting. The resulting electrochemical interconnections are highly reliable and have high tensile strengths.

REFERENCES:
patent: 4930001 (1990-05-01), Williams
patent: 5149671 (1992-09-01), Koh et al.
patent: 5186383 (1993-02-01), Melton et al.
patent: 5196371 (1993-03-01), Kulesza et al.
C. Bocking, "Laser Enhanced and High Speed Jet Selective Electrodeposition", Trans IMF 1988, 66, 50.

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