Electrochemical and mechanical polishing and shaping method...

Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – With control responsive to sensed condition

Reexamination Certificate

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C205S642000, C205S643000, C205S646000, C205S651000

Reexamination Certificate

active

08052860

ABSTRACT:
A method and system are provided for the shaping and polishing of the surface of a material selected from the group consisting of electrically semi-conductive materials and conductive materials. An electrically non-conductive polishing lap incorporates a conductive electrode such that, when the polishing lap is placed on the material's surface, the electrode is placed in spaced-apart juxtaposition with respect to the material's surface. A liquid electrolyte is disposed between the material's surface and the electrode. The electrolyte has an electrochemical stability constant such that cathodic material deposition on the electrode is not supported when a current flows through the electrode, the electrolyte and the material. As the polishing lap and the material surface experience relative movement, current flows through the electrode based on (i) adherence to Faraday's Law, and (ii) a pre-processing profile of the surface and a desired post-processing profile of the surface.

REFERENCES:
De Silva et al. teaching “Precision ECM by Process Characteristic Modelling”, Annals of the CIRP, 2000, v. 49, pp. 151-155.
Hocheng “The application of a turning tool as the electrode in electropolishing”, Journal of Materials Processing Technology, 2002, v. 120, pp. 6-12.
Hocheng et al. “A material removal analysis of electrochemical machining using flat-end cathode”, Journal of Materials Processing Technology, 2003, v. 140, pp. 264-268.
Bhattacharyya et al. “Experimental investigation on the influence of electrochemical machining parameters on machining rate and accuracy in micromachining domain”, International Journal of Machine Tools & Manufacture, 2003, v. 43, pp. 1301-1310.

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