Electroceramic component and method of manufacture thereof

Details Electroceramic component and method of manufacture thereof Electroceramic component and method of manufacture thereof

1999-02-22

2000-10-03

Jones, Deborah

Stock material or miscellaneous articles

Composite

Of quartz or glass

428469, 428472, 428701, 428702, 428210, 427100, 427101, 427102, 427103, B32B 1500

Patent

active

061270407

DESCRIPTION:

BRIEF SUMMARY
The present invention relates to electroceramic components and also to a method production thereof.
An electroceramic component of this type is disclosed in WO-A-90 16074.
Electrical functional-ceramic components generally comprise a component body, which defines the component function and is made of functional ceramic, connection metallization coatings provided on said body, as well as a protective encapsulation on areas of the component body which are free from the connection metallization coatings. The term "functional ceramic" is in this case understood to mean active electroceramics, for example for electrical conductors. In the case of components of the type under discussion, which are suitable for SMD mounting, a generally parallelepipedal component body is provided in the case of which cap-shaped connection metallization coatings are provided on two mutually opposite ends. The surface regions of the component body which are free from these cap-shaped connection metallization coatings are provided with the protective encapsulation.
In the case of these components, the protective encapsulation serves to minimize surface influences in order to ensure a defined flow of current through the component. The protective encapsulation ensures better current division between the cap-shaped connection metallization coatings, improves the robustness and affords protection against surface reactions.


SUMMARY OF THE INVENTION

The present invention is based on at least one object of specifying a protective encapsulation of the type under discussion with which multilayer connection metallization coatings can be realized by means of standard electrodeposition conditions and the components provided with said connection metallization coatings can be employed in the range from low voltages up to power supply voltages.
This object is achieved by means of an electroceramic component that comprises a ceramic component body suitable for SMD mounting and which is parallelepiped shaped and which further comprises first and second pairs of opposing outer walls and two opposing ends. Each opposing end of the ceramic component body is coated with a connection metallization coating. The first pair of opposing outer walls is covered with a first protective encapsulation material; the second pair of opposing outer walls is covered with a second protective encapsulation material.
In an embodiment, the first protective encapsulation material comprises a laminate and the second protective encapsulation material comprises a high-resistance layer.
In an embodiment, the laminate is an insulating material.
In an embodiment, the laminate is selected from the group consisting of BaTiO.sub.3, SiO.sub.2 and Al.sub.2 O.sub.3.
In an embodiment, the laminate is glass.
In an embodiment, the laminate is a high-resistance ceramic which is identical to the ceramic of the component body.
In an embodiment, the high-resistance layers are doped.
In an embodiment, the high-resistance layers each comprise an outer surface and the outer surfaces of the high-resistance layers are doped.
A method for producing a component according to the invention comprises the steps of providing a parallelepiped-shaped ceramic component body comprising first and second pairs of opposing outer walls and two opposing ends, providing two laminate sheets, providing two high-resistance sheets, covering each outer wall of the first pair of opposing outer walls with one of the laminate sheets, covering each outer wall of the second pair of opposing outer walls with one of the high-resistance sheets, and covering each of the opposing ends of the component with a connection metallization coating.
In an embodiment, the method further comprises the step of doping the high-resistance sheets near outer surfaces thereof with a conductive dopant.
In an embodiment, the doping of the high-resistance sheets is performed by impregnating the component body with an agent containing the dopant.
In an embodiment, the impregnation agent is a suspension containing the dopant.
In an embodiment, t

REFERENCES:
patent: 3496512 (1970-02-01), Matsuoka et al.
patent: 3905006 (1975-09-01), Matsuoka et al.
patent: 4434416 (1984-02-01), Schonberger
patent: 4480376 (1984-11-01), Hakanson
patent: 4766409 (1988-08-01), Mandai
patent: 4786888 (1988-11-01), Yoneda et al.
patent: 5072329 (1991-12-01), Galvagni
patent: 5195019 (1993-03-01), Hertz
patent: 5614074 (1997-03-01), Ravindranathan
patent: 5750264 (1998-05-01), Ueno
Patent Abstracts of Japan, vol. 096, No. 007, Jul. 31, 1996 & JP 08 064462 A.

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