Electroacoustic component and method for the production thereof

Details Electroacoustic component and method for the production thereof Electroacoustic component and method for the production thereof

2007-08-28

2007-08-28

Summons, Barbara (Department: 2817)

Wave transmission lines and networks

Coupling networks

Electromechanical filter

C333S195000, C333S150000

Reexamination Certificate

active

11294077

ABSTRACT:
An electroacoustic component including a layer system disposed between two substrates and electroacoustic structures for exciting a guided bulk acoustic wave, the electroacoustic structures being devoid of cavities. The layer system includes a piezo-electric layer, at least one metal layer, and a planarizing layer, which includes a planar interface provided with a substrate disposed directly thereabove. Such a component can be produced at a low cost by direct wafer bonding of two wafers. The electroacoustic component structures are electrically connected to the external contacts through perpendicular electrical connections.

REFERENCES:
patent: 3983514 (1976-09-01), Coussot
patent: 4328472 (1982-05-01), Grudkowski
patent: 6046656 (2000-04-01), Mishima
patent: 6445265 (2002-09-01), Wright
patent: 2216654 (1975-09-01), None
patent: 10-335974 (1998-12-01), None
patent: 03/088475 (2003-10-01), None
Toshio Irino et al.: “Propagation of Boundary Acoustic Waves Along a ZnO Layer between Two Material”, IEEE Transaction on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 35, No. 6, Nov. 1988, pp. 701-707.
Yukio Ito et al.: “High-Frequency Ultrasonic Transducer Arrays Using ZnO Thin Films”, 1993 Ultrasonics Symposium, pp. 1117-1125.
Japanese Patent Abstract No. 10335974, dated Dec. 18, 1998 to Yoshihiro.

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