Electro-optically assisted bonding

Details Electro-optically assisted bonding Electro-optically assisted bonding

1979-08-09

1981-10-13

Kellogg, Arthur D.

Glass manufacturing

Processes

Fusion bonding of glass to a formed part

65 59R, 65 59B, 65DIG4, 204192P, C03C 2700

Patent

active

042946026

ABSTRACT:
A method of bonding a cover glass to a semiconductor substrate having conductors thereon. The cover glass and the semiconductor substrate are placed in a relatively high voltage field and heated to induce ion drift in the glass and improved conductivity in the substrate. Additional localized heating softens the cover glass in the vicinity of the conductors permitting the cover glass to flow around the conductors and to be drawn into contact and bonded with the substrate.

REFERENCES:
patent: 3397278 (1968-08-01), Pomerantz
patent: 3417459 (1968-12-01), Pomerantz et al.
patent: 3452178 (1969-06-01), Kleen
patent: 3981230 (1976-09-01), Lee
"Field Assisted Glass-Metal Sealing", Journal of Applied Physics, vol. 40, No. 10, 9/69, pp. 3946-3949, G. Wallis & D. Pomerantz.
"Integrally Bonded Covers for Silicon Solar Cells", Proceeding of the 11th IEEE Photovoltaic Specialists Conf., 1975, pp. 169-170, A. Kirkpatrick.

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