Electro-optical multiple connection arrangement

Optical waveguides – Integrated optical circuit

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25022724, 385 53, G02B 612

Patent

active

050548700

ABSTRACT:
For the connection of an electro-optical chip (5) to a substrate (4), optical and electrical connecting elements (1, 8) are produced on a flexible interconnect member (2) and connected, using a film bonding process previously known only for purely electrical connections, both with connector elements of the chip and with connector paths or optical waveguides (3) on the substrate. If the optical connecting elements (1) are positioned physically between the electrical connecting elements (8), they are secured and located by the soldering connections produced on both sides of the electrical connecting elements. In addition to electrical test adapter connectors, optical test loops which link optical inputs and outputs with each other and which are removed during a later stamping process can also be provided on the flexible interconnect member (2).

REFERENCES:
patent: 4597631 (1986-07-01), Flores
patent: 4611886 (1986-09-01), Cline et al.
patent: 4695120 (1987-09-01), Holder
patent: 4732446 (1988-03-01), Gipson et al.
patent: 4871224 (1989-10-01), Karstensen et al.
Feil et al., "Hybridintegration, Technologie und Entwurf von Dickschichtschaltungen," Dr. Alfred Huthig Verlag, Heidelberg, 1986.
Muller, Prof. Helmut, "Hochtechnologie-Multilayer," Eugen G. Leuze Verlag, 1988.

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