Electro-optical device and electronic apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C174S250000

Reexamination Certificate

active

07746659

ABSTRACT:
The invention provides a heat dissipater such as a heat dissipation member that dissipates heat of an integrated circuit that is formed on a flexible substrate such as a flexible printed circuit board. The heat dissipater according to an aspect of the invention includes; a main body section that is formed in the shape of a hollow sleeve in such a manner that the flexible substrate can be inserted through and inserted inside the main body section; and an adhering section that is formed on an inner surface of the main body section in such a manner that the main body section and the integrated circuit are adhered to each other via the adhering section.

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patent: 7576988 (2009-08-01), Schwarz
patent: 2007/0211426 (2007-09-01), Clayton et al.
patent: 2008/0218974 (2008-09-01), Bartley et al.
patent: 2009/0002951 (2009-01-01), Legen et al.
patent: 6-077361 (1994-03-01), None
patent: 7-254668 (1995-10-01), None
patent: 9-172112 (1997-06-01), None
patent: 10-032305 (1998-02-01), None
patent: 2001-274303 (2001-10-01), None
patent: 2004-252331 (2004-09-01), None
patent: 2005-338706 (2005-12-01), None

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