Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2008-05-02
2009-12-01
Gurley, Lynne A. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S048000, C257SE31001, C324S537000, C324S754090, C324S765010, C438S011000, C438S014000, C438S017000, C438S018000
Reexamination Certificate
active
07626240
ABSTRACT:
This invention provides a circuit bonding detection device, a detection method thereof and an electro-optical apparatus incorporating the circuit bonding detection device. The circuit bonding detection device includes a substrate, a circuit module, a set of sensors, and a detection unit. A plurality of contact pads is disposed on the substrate. The circuit module includes a plurality of conductive bumps corresponding to the contact pads. The sensors are disposed on two sides of at least one of contact pads or of the corresponding conductive bumps. The detection unit is electrically coupled with the set of sensors and transmits a fault signal when at least one of the contact pads and the corresponding conductive bumps deforms and contacts the sensors.
REFERENCES:
patent: 7074704 (2006-07-01), Kwon et al.
patent: 2008/0006952 (2008-01-01), Lee et al.
patent: 04-060472 (1992-02-01), None
patent: 2005-227217 (2005-08-01), None
English language translation of abstract of JP 04-060472.
English language translation of abstract of JP 2005-227217.
Chou Shih-Ping
Huang Ching-Yu
Tsai Ying-Hung
AU Optronics Corporation
Gurley Lynne A.
Kearney Naima J
Thomas Kayden Horstemeyer & Risley
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