Electro-optic device assembly having integral heat sink/retentio

Details Electro-optic device assembly having integral heat sink/retentio Electro-optic device assembly having integral heat sink/retentio

1981-12-07

1991-07-16

Carroll, J.

357 68, 357 74, 350 962, H01L 2348, H01L 2302

Patent

active

050328980

ABSTRACT:
An electro-optic device assembly and handling technique is disclosed. The assembly comprises an elongate combination heat sink and retention clip, a heat dispersive substrate affixed to one elongate face of the clip and having lead means secured to an outward face thereof, and an electrooptic chip mounted upon the substrate making electrical contact with the leads. A length of waveguide is bonded to an active portion of the chip, and a ferrule member is provided having a profiled passageway for receiving the above assembly therein. Subsequently, the ferrule is inserted into a header housing, and malleable ends of the heat sink clip are inwardly clasped upon the profile of the header housing to secure the heat sink clip, and assembly elements thereupon, to the connector housing.

REFERENCES:
patent: 3447057 (1969-05-01), Brown et al.
patent: 3549958 (1970-12-01), Margolien
patent: 3590341 (1971-06-01), Preston
patent: 3609471 (1971-09-01), Scace
patent: 3760175 (1973-09-01), Gibson et al.
patent: 3763403 (1973-10-01), Lootens
patent: 3783347 (1974-01-01), Vladik
patent: 3786317 (1974-01-01), Thierfeider
patent: 3820153 (1974-06-01), Quinn
patent: 3839660 (1974-10-01), Stryker
patent: 3946416 (1976-03-01), Hacskaylo
patent: 4144541 (1979-03-01), Schaefer et al.
patent: 4151544 (1979-04-01), Riff
patent: 4167303 (1979-09-01), Bowen et al.
patent: 4186995 (1980-02-01), Schumacher
patent: 4186996 (1980-02-01), Bowen et al.
patent: 4192574 (1980-03-01), Henry
patent: 4233619 (1980-11-01), Webb et al.
patent: 4241978 (1980-12-01), Dubois et al.
patent: 4265512 (1981-05-01), Chiron et al.
patent: 4273413 (1981-06-01), Bendiksen et al.
patent: 4278990 (1981-07-01), Fichot
patent: 4307934 (1981-12-01), Palmer
patent: 4399453 (1983-08-01), Berg et al.
patent: 4469401 (1984-09-01), Yamazaki et al.
K. Nawata et al, "Active and Passive Devices for Optical Fiber Transmission Systems", Review of the Electrical Communication Laboratories, vol. 27 (Nov.-Dec., 1979), pp. 1010-1020.
A. Albanese et al, "LED Array Package for Optical Data Links", The Bell System Technical Journal, vol. 58 (Mar., 1979) pp. 713-720.
Technical Disclosure Bulletin: IBM vol. 21, No. 4, Sep. 1978.

Affiliated with

Also associated with

Rating

Electro-optic device assembly having integral heat sink/retentio does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electro-optic device assembly having integral heat sink/retentio, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electro-optic device assembly having integral heat sink/retentio will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-135851