Electro-nickel plating activator composition, a method for using

Details Electro-nickel plating activator composition, a method for using Electro-nickel plating activator composition, a method for using

1987-07-16

1989-02-21

Lieberman, Paul

Compositions: coating or plastic

Coating or plastic compositions

Proteinaceous material containing

427304, 427305, C23C 1828

Patent

active

048061590

ABSTRACT:
A plating activator composition that is largely silver is applied in a thin film to two surface areas of a ceramic chip capacitor. Subsequently, many such chip capacitors are electrolytically nickel plated, e.g. are electro-nickel barrel plated to provide two strongly adhered nickel terminals to the component. This activator composition consists essentially of at elast 85% Ag, from 0.1 to 7% Pd, from 1% to 10% of an element selected from Cu, Si, Bi, Zn, Fe, Ni, Sn, Zr, Nb, Sb, Mn and combinations thereof. These terminals are strong, truly conformal and are highly manufacturable.

REFERENCES:
patent: 2690402 (1954-09-01), Crehan
patent: 3035944 (1962-05-01), Sher et al.
patent: 3135046 (1964-06-01), Stookey
patent: 3867174 (1975-02-01), Maekawa et al.
patent: 4425378 (1984-01-01), Maher
patent: 4622069 (1986-11-01), Akai et al.
patent: 4734299 (1988-03-01), Matuzaki et al.

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