Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-04-04
1999-01-26
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 257717, 361688, 361676, H01L 2334, H05K 100, H05K 156
Patent
active
058641769
ABSTRACT:
A temperature control system includes an electro-mechanical subassembly having an enhanced thermal interface, which comprises: an electronic device which has a face that dissipates heat; a heat exchange member which has a face that mates with the heat dissipating face of the electronic device; and, a film of liquid, lying between the mating faces of the heat exchange member and the electronic device, which evaporates without leaving any residue at a temperature that is too low to damage the electronic device. Due to the presence of the liquid film, the thermal resistance between the mating faces of the heat exchange member and the electronic device is reduced by over 1000% from which it otherwise is when film is deleted.
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Babock James Wittman
Tustaniwskyi Jerry Ihor
Clark Jhihan B.
Peterson Steven R.
Saadat Mahshid
Starr Mark T.
Unisys Corporation
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