Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Patent
1995-06-30
1996-11-05
Ledynh, Bot L.
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
428 359, H05K 900
Patent
active
055719910
ABSTRACT:
An enclosure for an electronic device forms a barrier to electro-magnetic radiation. A typical cross-section of the enclosure comprises three parallel layers. The outer and inner surface layers are of a polymeric base material in which is suspended an electrically conductive fill material, giving the surface layers relatively high electrical conductivity. The middle layer is of a polymeric base material, in which is suspended fill material having high magnetic permeability, giving the middle layer relatively high magnetic permeability. In the preferred embodiment, the enclosure is constructed using a co-injection molding process. Nickel-coated graphite (high conductivity) in a polymeric base is injected into a mold from the outer co-injection nozzle, while carbonyl iron powder (high permeability) in a polymeric base is injected into the mold from the inner co-injection nozzle. The resultant molded structure contains the three layers described above, yet can be made inexpensively in a single co-injection molding operation. The enclosure may comprise multiple co-injection molded pieces, which are attached together by any of various conventional techniques.
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Electronic Packaging & Production (aka EP&) Jan. 1991 pp. 40-44 "Shielding Electronics From EMI/RFI" by H. W. Markstein.
Highum Edward A.
Mueller Alfred W.
Nash Thomas W.
Stadler Ewald E. G.
Thorvilson Scott M.
Bussan Matthew J.
International Business Machines - Corporation
Ledynh Bot L.
Truelson Roy W.
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