Electro-lithography method

Details Electro-lithography method Electro-lithography method

1977-06-17

1978-10-10

Thurlow, Jeffery R.

Plastic and nonmetallic article shaping or treating: processes

Carbonizing to form article

Agglomeration or accretion

29625, 156345, 204155, 204165, 250531, 264101, 427 35, H01J 3731

Patent

active

041196880

ABSTRACT:
An electro-lithography method suitable for forming a high resolution pattern in an electron sensitive resist material is disclosed. This technology permits the inexpensive high resolution reproduction of masks for use in integrated circuits and magnetic bubbles. The method involves the application of a pulsed, electric field to two parallel electrodes having an electron beam resist layer positioned on one of the electrodes and a mask positioned between the second electrode and the resist layer. The mask forms a gap having a thickness of 10.sup.-4 m to 10.sup.-5 m with the resist layer.

REFERENCES:
patent: 3453723 (1969-07-01), Cecil
patent: 3668028 (1972-06-01), Short
patent: 3679497 (1972-07-01), Handy et al.
patent: 3681103 (1972-08-01), Brown
patent: 3873371 (1975-03-01), Wolf
patent: 3931435 (1976-01-01), Gipstein et al.
patent: 3956052 (1976-05-01), Koste et al.
"High-Resolution Positive Resists for Electron-Beam Exposure," IBM Journal-May, 1968, pp. 251-256, Haller et al.
Electron Imaging System for Fabrication of Integrated Circuits, Solid State Electronics, vol. 12, 1969, O'Keeffe et al. pp. 841-848.

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