Electro-conductive metal plated polyimide substrate

Details Electro-conductive metal plated polyimide substrate Electro-conductive metal plated polyimide substrate

2005-12-27

2005-12-27

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S458000, C428S655000

Reexamination Certificate

active

06979497

ABSTRACT:
An electro-conductive metal plated polyimide substrate is composed of an aromatic polyimide substrate, a subbing metal layer of Mo—Ni alloy (in which a weight ratio of Mo to Ni is 75/25 to 99/1, and a plated electro-conductive film.

REFERENCES:
patent: 5741598 (1998-04-01), Shiotani et al.
patent: 6129982 (2000-10-01), Yamaguchi et al.
patent: 6245432 (2001-06-01), Funada et al.
patent: 6379784 (2002-04-01), Yamamoto et al.
patent: 6548180 (2003-04-01), Yamamoto et al.
patent: 6596968 (2003-07-01), Yamamoto et al.

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