Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1998-07-15
1999-10-26
Gupta, Yogendra
Compositions
Electrically conductive or emissive compositions
Free metal containing
252513, 252514, 174257, H01B 122
Patent
active
059722460
ABSTRACT:
Provided are an electro-conductive composition improved on its wettability and handled with ease and an electronic equipment using the same. The electro-conductive composition comprises: 28 to 45 wt % metallic particles X to form an alloy with a solder at a soldering temperature and to increase a melting point of the solder to a temperature higher than the soldering temperature; 30 to 60 wt % metallic particles Y hard to form an alloy with the solder at the soldering temperature, wherein the sum of contents of the metallic particles X and Y is in the range of 75 to 93 wt %; and the rest of a resin.
REFERENCES:
patent: 4996005 (1991-02-01), Saito et al.
patent: 5011627 (1991-04-01), Lutz et al.
patent: 5678168 (1997-10-01), Brown et al.
patent: 5855820 (1999-01-01), Chan et al.
Nikaidoh Takashi
Ono Yasuichi
Suzuki Katsuyuki
Alps Electric Co. ,Ltd.
Gupta Yogendra
Hamlin Derrick G
LandOfFree
Electro-conductive composition and electronic equipment using sa does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electro-conductive composition and electronic equipment using sa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electro-conductive composition and electronic equipment using sa will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-760112