Electro-chemical processor with wafer retainer

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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C204S297010

Reexamination Certificate

active

07811422

ABSTRACT:
A wafer plating apparatus has a rotor in a head including wafer retainers which properly hold a wafer on the rotor in position. A seal on the head seals plating bath liquid away from the edges of the wafer. After plating is completed and the wafer is moved away from the seal, the wafer retainers prevent the wafer from sticking to the seal. The rotor may include a backing plate adapted to support a wafer during processing, with the wafer retainers pivotally attached to the backing plate. Movement of the backing plate relative to a seal may move the wafer retainers between open and closed or engaged positions.

REFERENCES:
patent: 6167893 (2001-01-01), Taatjes et al.
patent: 6273484 (2001-08-01), Peng
patent: 6333275 (2001-12-01), Mayer
patent: 6537416 (2003-03-01), Mayer
patent: 7118658 (2006-10-01), Woodruff et al.
patent: 2005/0189213 (2005-09-01), Woodruff

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