Electro-chemical mechanical planarization pad with uniform...

Details Electro-chemical mechanical planarization pad with uniform... Electro-chemical mechanical planarization pad with uniform...

2006-11-21

2010-10-19

Wilkins, III, Harry D (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S242000, C204S279000, C205S662000, C205S663000, C205S668000

Reexamination Certificate

active

07815778

ABSTRACT:
A polishing pad includes at least one conductive polishing element supported by a compressible under layer having conductive patterning therein, the conductive patterning adapted to permit coupling of a potential to the conductive polishing element; a guide plate above the compressible under layer, the guide plate having a hole through which the polishing element passes and further having a cathodic element connected thereto; and a slurry distribution layer adhered to the guide plate opposite the compressible under layer. The polishing pad may further include a proton exchange membrane placed over the cathodic element. A semiconductor wafer having a metal film thereon may be polished using the polishing pad by placing the wafer in contact with the polishing element, applying anodic current to the polishing element and cathodic current to the cathodic element, and polishing with an anodic solution. For copper films, a sulfuric acid-copper sulfate solution may be used.

REFERENCES:
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5489233 (1996-02-01), Cook et al.
patent: 5607346 (1997-03-01), Wilson et al.
patent: 5609517 (1997-03-01), Lofaro
patent: 5795218 (1998-08-01), Doan et al.
patent: 5893976 (1999-04-01), Bauer
patent: 6019666 (2000-02-01), Roberts et al.
patent: 6024630 (2000-02-01), Shendon et al.
patent: 6089965 (2000-07-01), Otawa et al.
patent: 6090475 (2000-07-01), Robinson et al.
patent: 6498101 (2002-12-01), Wang
patent: 6612916 (2003-09-01), Kollodge et al.
patent: 6794605 (2004-09-01), Park et al.
patent: 6962524 (2005-11-01), Butterfield et al.
patent: 6986705 (2006-01-01), Preston et al.
patent: 7020306 (2006-03-01), Hirose et al.
patent: 7192340 (2007-03-01), Ono et al.
patent: 2001/0035354 (2001-11-01), Ashjaee et al.
patent: 2001/0039175 (2001-11-01), Golzarian et al.
patent: 2002/0173255 (2002-11-01), Shendon et al.
patent: 2003/0132120 (2003-07-01), Emesh et al.
patent: 2003/0153245 (2003-08-01), Talieh et al.
patent: 2003/0209528 (2003-11-01), Choo et al.
patent: 2003/0220053 (2003-11-01), Manens et al.
patent: 2004/0110381 (2004-06-01), Yoshida
patent: 2004/0163946 (2004-08-01), Chang et al.
patent: 2004/0163950 (2004-08-01), Emesh
patent: 2004/0166779 (2004-08-01), Balijepalli et al.
patent: 2004/0214510 (2004-10-01), So
patent: 2004/0232121 (2004-11-01), Park et al.
patent: 2005/0061674 (2005-03-01), Wang et al.
patent: 2005/0092621 (2005-05-01), Hu et al.
patent: 2005/0124262 (2005-06-01), Manens
patent: 2005/0159084 (2005-07-01), Basol et al.
patent: 2006/0079159 (2006-04-01), Naujok et al.
patent: 2001071256 (2001-03-01), None
patent: 2004-255478 (2004-09-01), None
Bajaj, Rajeev, PCT/US05/35978, International Search Report and Written Opinion, Mar. 15, 2006, 10pp, International Searching Authority-US, Alexandria, Virginia.
Bajaj, Rajeev, PCT/US05/35979 filed Oct. 5, 2005, International Search Report and Written Opinion, Feb. 24, 2006, 8pp, International Searching Authority-US, Alexandria, Virginia.
Bajaj, Rajeev, PCT/US05/35732 filed Oct. 5, 2005, International Search Report and Written Opinion, Nov. 28, 2006, 6pp, International Searching Authority-US, Alexandria, Virginia.
Bajaj, Rajeev, PCT/US05/35660 filed Oct. 5, 2005, International Search Report and Written Opinion, Jun. 15, 2007, 8pp, International Searching Authority-US, Alexandria, Virginia.
Bajaj, Rajeev; PCT/US05/35978 filed Oct. 5, 2005; International Preliminary Report on Patentability; WIPO; Jun. 7, 2007; 7pp.
Bajaj, Rajeev; PCT/US05/35979 filed Oct. 5, 2005; International Preliminary Report on Patentability; IPEA/US; Sep. 27, 2006; 7pp.
Bajaj, Rajeev; PCT/US05/35732 filed Oct. 5, 2005; International Preliminary Report on Patentability; WIPO; Jun. 7, 2007; 5pp.
Bajaj, Rajeev; PCT/US05/35660 filed Oct. 5, 2005; International Preliminary Report on Patentability; WIPO; Jul. 19, 2007; 6pp.

Affiliated with

Also associated with

Rating

Electro-chemical mechanical planarization pad with uniform... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electro-chemical mechanical planarization pad with uniform..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electro-chemical mechanical planarization pad with uniform... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4239296