Electro ceramic components

Details Electro ceramic components Electro ceramic components

2006-05-23

2006-05-23

Smith, Brad (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

C257S499000, C257S421000

Reexamination Certificate

active

07049670

ABSTRACT:
An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

REFERENCES:
patent: 5962949 (1999-10-01), Dhuler et al.
patent: 6124663 (2000-09-01), Haake et al.
patent: 6480645 (2002-11-01), Peale et al.
patent: 6509816 (2003-01-01), Staker et al.

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