Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Microphone capsule only
Reexamination Certificate
2006-07-24
2010-12-28
Ensey, Brian (Department: 2614)
Electrical audio signal processing systems and devices
Electro-acoustic audio transducer
Microphone capsule only
C381S191000
Reexamination Certificate
active
07860258
ABSTRACT:
A transducer for transmitting and receiving ultrasonic waves to a diaphragm-based ultrasonic transducer device using silicon as a base material. An electro-acoustic transducer device which can have a first electrode formed on top of, or inside, a substrate and having a thin film provided on top of the substrate. The device can also have a second electrode formed on top of, or inside, the thin film. A void layer can be provided between the first electrode and the second electrode. A charge-storage layer can be provided between the first electrode and the second electrode. A source electrode and a drain electrode can also be provided for measuring a quantity of electricity stored in the charge-storage layer.
REFERENCES:
patent: 2003/0048914 (2003-03-01), Yi et al.
patent: 2005/0177045 (2005-08-01), Degertekin et al.
Haller, Matthew I et al, “A Surface Micromachined Electrostatic Ultrasonic Air Transducer”, IEEE Ultra Sonic Symposium, 1994, pp. 1241-1244.
Hohm, D. et al, “Silicon-dioxide electret transducer”, Accust. Soc. Am, Apr. 1964, pp. 1297-1298.
Amjadi, Houman et al, “Silicon-based Inorganic Electrets for Application in Micromachined Devices”, IEEE Transactions on Dielectrics and Electrical Insulation, vol. 3, No. 4, Aug. 1996, pp. 494-498.
Azuma Takashi
Fukuda Hiroshi
Machida Shuntaro
Mine Toshiyuki
Nagata Tatsuya
Ensey Brian
Hitachi , Ltd.
Marquez, Esq Juan Carlos A.
Stites & Harbison PLLC
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