Electrifying method and manufacturing method of...

Details Electrifying method and manufacturing method of... Electrifying method and manufacturing method of...

2006-12-19

2006-12-19

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Electron emitter manufacture

C313S249000

Reexamination Certificate

active

07151005

ABSTRACT:
A method according to the present invention is for electrifying a plurality of electric conductors arranged on a substrate including the step of setting an average temperature difference during electrifying processing between a region S0in that the plurality of electric conductors on the substrate are arranged and a circumferential region S1of the region S0at 15° C. or more, and the substrate satisfies the relational expression:in-line-formulae description="In-line Formulae" end="lead"?L1/L0>EαΔT/σth−1.in-line-formulae description="In-line Formulae" end="tail"?whereL0[m]: the width of the region S0L1[m]: the width of the region S1ΔT[K]: the average temperature differenceE[Pa]: the Young's modulus of the substrateα[/K]: the coefficient of linear thermal expansion of the substrateσth[Pa]: the material constant of the substrate.

REFERENCES:
patent: 5622634 (1997-04-01), Noma et al.
patent: 6169356 (2001-01-01), Ohnishi et al.
patent: 6726520 (2004-04-01), Takeda et al.
patent: 6848961 (2005-02-01), Nomura et al.
patent: 2001/0036682 (2001-11-01), Takeda et al.
patent: 2002/0063535 (2002-05-01), Azuma
patent: 7-235255 (1995-09-01), None
patent: 8-171849 (1996-07-01), None
patent: 2000-311594 (2000-11-01), None

Affiliated with

Also associated with

Rating

Electrifying method and manufacturing method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrifying method and manufacturing method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrifying method and manufacturing method of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3697741