Electrified object contact component

Stock material or miscellaneous articles – Composite – Of metal

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Details

148566, 148DIG118, B32B 1504

Patent

active

056459432

ABSTRACT:
An electrified object contact material characterized in that an oxide film formed in a high purity oxidizing atmosphere with a thickness from several tens to 100 .ANG. is formed at least in a section directly contacting an electrified object. By using the contact component according to the present invention, the electric potential of a wafer can always be suppressed to 50 V or less, and moreover, contamination of a wafer (especially by a metallic material) can completely be eliminated.

REFERENCES:
patent: 4247422 (1981-01-01), Davies
patent: 4491622 (1985-01-01), Butt
patent: 4495008 (1985-01-01), Bruno et al.
patent: 4500611 (1985-02-01), Nickol et al.
patent: 4511634 (1985-04-01), Nickol
patent: 4826737 (1989-05-01), Yamada et al.
patent: 5264394 (1993-11-01), Ruckman et al.
"Wafer Handling Robotic End-of-Arm Tool For Operation in Clean Room Environments" Abstr. No. 30 759.

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