Electrically tested and burned-in semiconductor die and method f

Details Electrically tested and burned-in semiconductor die and method f Electrically tested and burned-in semiconductor die and method f

1993-01-08

1995-09-05

Nguyen, Vinh P.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324765, G01R 3100

Patent

active

054481651

ABSTRACT:
A semiconductor die is temporarily enclosed in a package. The packaged die is then electrically tested and burned in. The tested die is then removed from the package. If the die performed acceptably during test and burn-in, the die is retained and either used in a production integrated circuit or sold as an unpackaged individual die. The method is simple, inexpensive, and provides semiconductor dice of high reliability (packaged die yields approach 100%). Existing test and production facilities, equipment and process flows may be used with, at most, minor changes to process a semiconductor die for any application. Semiconductor dice processed by the method are particularly useful for complex and/or costly packaging options, e.g., multichip modules, hybrid circuits or chip-on-board.

REFERENCES:
patent: 3583561 (1971-06-01), Wiesler et al.
patent: 4351108 (1982-09-01), Johnson
patent: 4866508 (1989-09-01), Eichelberger et al.
patent: 4985988 (1991-01-01), Littlebury
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5149662 (1992-09-01), Eichelberger
patent: 5173451 (1992-12-01), Kinsman et al.
Gene Cloud, et al., "Known-Good Die: A Key to Cost-Effective MCMs," Electronic Packaging & Production, Sep. 1992, pp. 50-51.

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