Electrically programmable interconnect element for integrated ci

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

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257208, 257209, 257529, 257750, H01L 2702, H01L 2348

Patent

active

054518113

ABSTRACT:
A user-programmable interconnect device includes a first lower electrode comprising a conductive material. A layer of dielectric material is disposed over the top surface of the lower conductor. An antifuse material, such as one or more layers of a dielectric material, amorphous silicon, or combinations of such materials, is located in an aperture in the dielectric material where the interconnect element of the present invention is to be formed. A second, upper electrode of conductive material is formed over the top of the antifuse material. A portion of the upper electrode located immediately above the antifuse material is fabricated as a fuse material. A passivation layer covers the second electrode and may have an aperture located therein at a location immediately above the antifuse and fuse material. Electrical connections to circuitry incorporating the interconnect element of the present invention are made to the lower and upper electrodes.

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