Electrically isolated heatsink for single-in-line package

Details Electrically isolated heatsink for single-in-line package Electrically isolated heatsink for single-in-line package

1989-04-03

1990-10-02

James, Andrew J.

357 74, 357 75, 357 68, H01L 2340, H01L 2336

Patent

active

049611070

ABSTRACT:
An improved semiconductor device package and method include, in a first embodiment, a die supporting leadframe having fingers inside the package body which are interleaved with mating fingers of a metallic heat extractor, without touching. A thermally conductive encapsulation fills the spaces between and around the fingers to provide thermal coupling and electrical isolation. The heat extractor extends outside the package body. Alternatively, the heat extractor and the leadframe have large parallel faces inside the package body which are arranged in a face-to-face relationship, without touching. An insulating spacer locks the opposing faces in the spaced-apart, electrically isolated relationship. An encapsulation fills any remaining space between the faces to provide efficient thermal coupling.

REFERENCES:
patent: 3982271 (1976-09-01), Olivieri et al.
patent: 4095253 (1978-06-01), Yoshimura et al.
patent: 4541005 (1985-09-01), Hunter et al.
patent: 4800956 (1989-01-01), Hamburgen
patent: 4807018 (1989-02-01), Cellai

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