Electrically insulating encapsulation composition for semiconduc

Details Electrically insulating encapsulation composition for semiconduc Electrically insulating encapsulation composition for semiconduc

1982-04-23

1984-04-03

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523457, 523466, 524430, 524437, 524443, C08K 322

Patent

active

044408838

ABSTRACT:
Electrically insulating encapsulating composition for semiconductor arrangements, consisting of a mixture of a resin and an inorganic filler, characterized by the feature that the filler is a silicon compound prepared from at least one highly volatile silicon halogenide compound, selected from the group of silicon oxides, silicon oxide hydrates and silicon nitrides. The filler may be aluminum oxide or aluminum hydroxide prepared from a volatile aluminum halogenide compound.

REFERENCES:
patent: 2941905 (1960-06-01), Hofmann
patent: 2997528 (1961-08-01), Kessel et al.
patent: 3206330 (1965-09-01), Chottiner
patent: 3449641 (1969-06-01), Lee
patent: 4001128 (1977-01-01), Penneck
patent: 4206066 (1980-06-01), Rinehart
Elektronikpraxis, Nr. 3/4, Mar. 1968, pp. 21-24.
Electronics, Sep. 11, 1980, pp. 41 and 42.
Circuits Manufacturing, Aug. 1977, pp. 29-31.

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