Electrically insulating encapsulating composition for semiconduc

Details Electrically insulating encapsulating composition for semiconduc Electrically insulating encapsulating composition for semiconduc

1972-12-22

1976-01-06

Lechert, Jr., Stephen J.

Compositions

Electrolytes for electrical devices

252 635, 252 637, 252 64, 252 65, 252 67, H01B 300

Patent

active

039310264

ABSTRACT:
An electrically insulating composition adapted for the encapsulation of a miconductor body and for protecting the semiconductor surface against harmful impurities, comprising a mixture of a polymerizable organic resin, at least one filler which improves the electrical properties of the semiconductor body, and at least one organic chelating agent capable of binding undesirable impurities in said resin and in said filler.

REFERENCES:
patent: 3141850 (1964-07-01), Lybeck
patent: 3287311 (1966-11-01), Edwards
patent: 3429906 (1969-02-01), Swigar et al.

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