Electrically imprinting a semiconductor die with identifying inf

Details Electrically imprinting a semiconductor die with identifying inf Electrically imprinting a semiconductor die with identifying inf

1997-10-31

2000-01-25

Grant, William

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

700 94, 700113, 700117, G06F 1900, G06F 766

Patent

active

060186860

ABSTRACT:
An integrated circuit, a programming mechanism and a method are provided for programming manufacturing information upon non-volatile storage devices of the integrated circuit. The storage devices may be programmed after manufacture and prior to assembling the integrated circuit within a semiconductor package. Thereafter, the packaged circuit can be tested to determine where, how and when the integrated circuit was manufactured from among possibly numerous die within a wafer and wafer lot. The storage locations which receive manufacturing indicia are addressed in an address location entirely separate from the addresses which receive data during normal operation of the integrated circuit. Accordingly, manufacturing information is accessible by the manufacturer, and the customer is preferably made unaware of the address space employing those storage locations.

REFERENCES:
patent: 4510673 (1985-04-01), Shils et al.
patent: 4931997 (1990-06-01), Mitsuishi et al.
patent: 5084843 (1992-01-01), Mitsuishi et al.
patent: 5256578 (1993-10-01), Corley et al.
patent: 5360747 (1994-11-01), Larson et al.
patent: 5406566 (1995-04-01), Obara
patent: 5457408 (1995-10-01), Leung
patent: 5642307 (1997-06-01), Jernigan
patent: 5664093 (1997-09-01), Barnett et al.
patent: 5867714 (1999-02-01), Todd et al.
patent: 5892683 (1999-04-01), Sung
patent: 5905887 (1999-05-01), Wu et al.
U.S. Application Serial No. 08/984,722.
U.S. Application Serial No. 08/984,814.
U.S. Application Serial No. 08/975,343.

Affiliated with

Also associated with

Rating

Electrically imprinting a semiconductor die with identifying inf does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrically imprinting a semiconductor die with identifying inf, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrically imprinting a semiconductor die with identifying inf will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2322826