Electrically enhanced surface planarization

Details Electrically enhanced surface planarization Electrically enhanced surface planarization

2006-08-29

2006-08-29

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S036000, C451S054000, C451S287000

Reexamination Certificate

active

07097536

ABSTRACT:
A substrate processing apparatus equipped to employ electrical potential to assist in planarization and/or conditioning is provided.

REFERENCES:
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 6010964 (2000-01-01), Glass
patent: 6368190 (2002-04-01), Easter et al.
patent: 6464855 (2002-10-01), Chadda et al.
patent: 6776693 (2004-08-01), Duboust et al.
patent: 2004/0173461 (2004-09-01), Tsai et al.
patent: 2004/0214510 (2004-10-01), So
patent: 2004/0259479 (2004-12-01), Sevilla
patent: 2004/0266193 (2004-12-01), Bogart et al.
patent: 2004/0266327 (2004-12-01), Chen et al.
patent: 2005/0016868 (2005-01-01), Basol et al.
patent: 2005/0035000 (2005-02-01), Lee et al.

Affiliated with

Also associated with

Rating

Electrically enhanced surface planarization does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrically enhanced surface planarization, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrically enhanced surface planarization will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3671111